Direct laser writing of 3D electrodes on flexible substrates
M. A. Brown, K. M. Zappitelli, L. Singh, R. C. Yuan, M. A. Bemrose, V. Brogden, D. J. Miller, S. F. Cogan, T. J. Gardner
This paper introduces a method for fabricating high-aspect-ratio 3D microelectrode arrays on flexible substrates using direct laser writing and silicon thin-film processing for neural recording applications.
bioRxiv · Jun 7, 2022 · PreprintBioengineering