Mara Goff Prentiss

The paper uses molecular dynamics simulations to study how the mechanical properties of RecA nucleoprotein filaments change with increasing D-loop length during homologous recombination.

The paper reveals a two-tiered crossover patterning mechanism in budding yeast meiosis, with mechanical forces and Pch2/TRIP13 modulating triad components.

The paper shows that Chi sites at the ends of RecBCD-generated ssDNA tails prevent genomic rearrangements by ensuring proper homology search and strand exchange during bacterial recombinational repair.